Real Time Adaptive Active Fluid Flow Cooling

ABSTRACT

The present invention is generally directed to an apparatus providing real time adaptive active fluid flow cooling, for cooling an electronic system, an electronic system utilizing the same, and a method for providing real time adaptive active fluid flow cooling. The electronic system consists of a circuit board having a heat generating component, a heat dissipating element mounted to the heat generating component and an apparatus for providing real time adaptive active flow cooling. The apparatus consisting of a plurality of active cooling devices that remove heated air or fluid with ambient air or fluid by propelling an fluid flow stream in a first direction toward the heat dissipating element, and where at least one active cooling device contained in the plurality of active cooling devices propels an fluid flow stream in a second direction toward the heat dissipating element.

RELATED APPLICATIONS

This is a divisional application of application Ser. No. 11/682,578,filed Mar. 6, 2007, entitled REAL TIME ADAPTIVE ACTIVE FLUID FLOWCOOLING.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention generally relates to electronic system cooling. Inparticular, an embodiment of the invention relates to an adaptive activecooling device.

2. Description of the Related Art

Electronic system components (e.g., central processing units (CPUs),graphics cards, hard drives, etc.) generate large amounts of heat duringoperation. This heat must be removed from the components in order tomaintain safe operating temperatures. Overheated parts generally exhibita shorter maximum life-span and may give sporadic problems resulting insystem freezes or crashes. The foremost heat removal technique adds heatdissipating elements to hot surfaces thereby increasing the area of heatdissipation. In many instances fans, or other active cooling devices,exchange the heated air or fluid with cooler ambient air or fluid. Inother instances the power supplied to the system components is throttleddown in order to decrease heat generation.

SUMMARY OF THE INVENTION

The present invention is generally directed to an apparatus for coolingan electronic system, an electronic system utilizing the same, and amethod for providing real time adaptive active fluid flow cooling.

As processors, graphics cards, random access memory (RAM) and othercomponents in computers have increased in clock speed and powerconsumption, the amount of heat produced by these components has alsoincreased. Therefore removing heat has become a high priority forelectronic manufacturers. So much so that in many cases, electronicsystems are designed with multiple fans or other active fluid movingdevices cooling specific components. In these cases more fans areutilized than are necessary to prevent overheating if one of the fansfails. This design technique is otherwise known as redundant cooling.

Utilizing more fans than necessary adds costs, with incremental benefitin normal operation, to the electronic system. Therefore there is a needfor an apparatus for cooling an electronic system, an electronic systemutilizing the same, and a method for providing real time adaptive activefluid flow cooling utilizing only the number of fans necessary toadequately cool the heat generating component while concurrentlyproviding for acceptable cooling when there is a partial failure of thecooling system (i.e., when at least one fan fails to propel an airstream).

In an embodiment, an apparatus for cooling an electronic system isdescribed. The apparatus consists of a circuit board having a heatgenerating component, a heat dissipating element mounted to the heatgenerating component, and a plurality of active cooling devices thatremove heated air or fluid with ambient air or fluid by propelling anair or fluid flow stream in a first direction toward the heatdissipating element, and in response to the partial failure of thecooling system, at least one active cooling device contained in theplurality of active cooling devices propels an air or fluid flow streamin a second direction toward the heat dissipating element.

In an alternative embodiment, an electronic system utilizing theapparatus for cooling is described.

In an alternative embodiment a method providing for real time adaptiveactive fluid flow cooling is described. The method comprising the stepsof: providing for at least one heat generating component on a circuitboard within an electronic system to warm to a temperature higher thanthe electronic system ambient temperature; providing for the cooling ofthe at least one heat generating component by mounting a heatdissipating element thereupon; providing for the cooling of the heatdissipating element by directing the fluid flow streams of one or moreactive cooling device(s) toward the dissipating element; and in responseto a partial failure event, directing the fluid flow stream of one ormore active cooling device(s) toward the heat dissipating element in asecond direction.

BRIEF DESCRIPTION OF THE DRAWINGS

So that the manner in which the above recited features of the presentinvention are attained and can be understood in detail, a moreparticular description of the invention, briefly summarized above, maybe had by reference to the embodiments thereof which are illustrated inthe appended drawings.

It is to be noted, however, that the appended drawings illustrate onlytypical embodiments of this invention and are therefore not to beconsidered limiting of its scope, for the invention may admit to otherequally effective embodiments.

FIG. 1 illustrates a prior art apparatus for cooling an electronicsystem and is an example of redundant cooling.

FIG. 2 illustrates, according to an embodiment of the invention, anapparatus for cooling an electronic system in a normal operatingconfiguration.

FIG. 3 illustrates, according to an embodiment of the invention, theapparatus of FIG. 2 in a configuration wherein one active cooling devicehas failed.

FIG. 4A illustrates, according to an embodiment of the invention, thefront view of a particular active cooling device.

FIG. 4B illustrates the side view of the particular active coolingdevice of FIG. 4A.

FIG. 5 illustrates, according to an embodiment of the invention, anexploded view of the support structure supporting a plurality of theparticular active cooling device of FIG. 4A.

FIG. 6 illustrates a side view of the embodiment depicted in FIG. 5.

FIG. 7A illustrates, according to an embodiment of the invention, anisometric exploded view of an alternate particular active cooling deviceand a connector.

FIG. 7B illustrates a side view of the embodiment depicted in FIG. 7A.

FIG. 7C illustrates a top view of the connector depicted in FIG. 7A andFIG. 7B.

FIG. 8 illustrates, according to an embodiment of the invention, a topview of the apparatus of FIG. 2.

FIG. 9 illustrates, according to an embodiment of the invention, a topview of the apparatus of FIG. 3.

FIG. 10 illustrates, according to an embodiment of the invention, anisometric view of a particular circuit board.

FIG. 11 illustrates, according to an embodiment of the invention, anisometric view of a particular active cooling device supported by thecircuit board of FIG. 10.

FIG. 12 illustrates, according to an embodiment of the invention, a topview of a particular section of a circuit board.

FIG. 13 illustrates, according to an embodiment of the invention, abottom view of a particular active cooling device supported by thecircuit board of FIG. 12.

FIG. 14 illustrates a front view of the particular active cooling deviceof FIG. 13.

FIG. 15 illustrates, according to an embodiment of the invention, aparticular arrangement for cooling an electronic system.

FIG. 16 illustrates, according to an embodiment of the invention, anisometric assembly view of a particular supporting connector and aplurality of particular active cooling devices.

FIG. 17A illustrates a front view of the particular active coolingdevice of FIG. 16.

FIG. 17B illustrates a side view of the particular active cooling deviceof FIG. 16.

FIG. 17C illustrates a bottom view of the particular active coolingdevice of FIG. 16.

FIG. 17D illustrates an enhanced bottom view of the particular activecooling device of FIG. 16.

FIG. 18A illustrates a bottom view of the particular supportingconnector of FIG. 16.

FIG. 18B illustrates a front view of the particular supporting connectorof FIG. 16.

FIG. 18C illustrates an enhanced bottom view of the particularsupporting connector of FIG. 16.

FIG. 19 illustrates, according to an embodiment of the invention, anapparatus for cooling an electronic system in a normal operatingconfiguration.

FIG. 20 illustrates, according to an embodiment of the invention, ansupport structure supporting and providing rotation to a bank of coolingdevices.

FIG. 21 illustrates, according to an embodiment of the invention, theapparatus of FIG. 20 in a configuration wherein at least one activecooling device has failed.

FIG. 22 illustrates a top view of the apparatus of FIG. 21.

FIG. 23A illustrates, according to an embodiment of the invention, afront view of an active cooling device having spindles mounted on anaxis offset from the bisection axis.

FIG. 23B illustrates, according to an embodiment of the invention, aside view of the active cooling of FIG. 23A.

FIG. 24 illustrates, according to an embodiment of the invention, amethod providing for real time adaptive active fluid flow cooling.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The present invention is generally directed to an apparatus for coolingan electronic system, an electronic system utilizing the same, and amethod for providing real time adaptive active fluid flow cooling.

FIG. 1 illustrates a prior art apparatus 10 for cooling an electronicsystem. Further, apparatus 10 is an example of redundant cooling.Apparatus 10 consists of a circuit board 11 having a heat generatingcomponent 8 thereupon. Heat generating component may be any electricalcomponent that generates heat (e.g., processor chip, etc). Heatdissipating element 12 is mounted to heat generating component 8 therebyincreasing the area of heat dissipation. Heat dissipating element may beany known heat dissipation apparatus (e.g., heat sink, heat pipe, etc).A bank 14 of fans 9 exchanges the heated air or fluid with coolerambient air or fluid. Fans 9 are fixedly mounted to circuit board 11.

FIG. 2 illustrates an apparatus 15 for cooling an electronic system in anormal operating configuration according to an embodiment of the presentinvention. A bank 16 of active cooling devices 13 ₁-13 ₄, hereinreferred to generically as active cooling devices 13, exchanges heatedair or other fluid with cooler air or fluid. The active cooling devices13 are moveably mounted (e.g., rotatable) to circuit board 11. In afirst embodiment, bank 16 rotates about axis 5. In a second embodiment,bank 16 rotates about axis 6. In a third embodiment, each active coolingdevice 13 rotates about axis 6. In a fourth embodiment, each activecooling device rotates about axis 7. In a particular embodiment, activecooling devices receive electrical signals from circuit board 11 throughtraditional cable and connector apparatuses (not shown), or any otherknown apparatus. Other embodiments teaching the mechanisms, apparatus,methods, etc. enabling the movement of the active cooling devices arefurther described below.

FIG. 3 illustrates a particular embodiment of apparatus 15 upon thefailure of active cooling device 13 ₁. Because of the failure, activecooling device 13 ₁ is unable to propel a fluid stream, in a firstdirection, toward heat dissipating element 12. Active cooling devices 13₂-13 ₄ move (e.g., rotate) toward the failed active cooling device 13 ₁to compensate for the loss of the fluid stream. In a particularembodiment the amount of fluid propelled by cooling devices 13 ₂-13 ₄ isincreased to maintain a particular fluid flow rate. This increasing ordecreasing the flow rate emitted from the active moving device may beaccomplished by any known environment feedback and adjustment mechanism.When the failed active cooling device 13 ₁ is replaced with a functionalactive cooling device 13, active cooling devices 13 ₂-13 ₄ back to thenormal operating configuration as depicted in FIG. 2. Enablement of thisparticular rotation back may utilize the mechanisms, apparatus, methods,etc. of movement further described below. Other embodiments of rotationare enabled by any known powered rotation mechanism.

FIG. 4A and FIG. 4B illustrate active cooling device 18 able around axis7. Active cooling device 18 is similar to active cooling device 13,however active cooling device 18 utilizes at least one spindle to allowfor rotation. In a particular embodiment, active cooling device 18 moves(e.g., rotates) about two spindles 21 and 22. Spindles 21 and 22 arerotatable in relation to another body. In particular embodimentsspindles 21 and 22 are an axle, axis, pin, rod, shaft, etc. In aparticular embodiment spindles 21 and 22 are conductive, or in otherwords can carry an electric charge. In the particular embodiment wherespindles 21 and 22 are conductive, they can be utilized to carry currentto or from the active cooling device 18 to or from circuit board 11. Inother embodiments spindles are hollow serving as a conduit forelectrical wires carrying electrical signals to the active coolingdevices.

In a particular embodiment, as shown in FIG. 23A and FIG. 23B, axis 201is offset from the active cooling device 18 bisection axis (e.g., axis7). When spindles 21 and 22 are attached to active cooling device 18 onaxis 201, the force of the propelled fluid stream emitted from activecooling device 18 creates a moment 203, on active cooling device 18,about axis 201. The moment 203 causes active cooling device 18 to move(e.g., rotate). In order to ensure the fluid stream is emitted in afirst desired direction retention 205 is utilized. Retention 205 isattached to circuit board 11 (not shown in FIG. 23A). When it is desiredto emit the fluid stream in a second direction, retention 205 isdisabled. When retention 205 is disabled active cooling device 18 isfree to rotate.

FIG. 5 illustrates an exploded view of the support structure 19supporting a plurality of cooling devices 18. Support structure 19consists of lower portion 122 and upper portion 23. Lower portion 122and upper portion 23 have connector 24 configured to accept spindle 21.Cooling devices 18 install into support structure 19 by insertingspindle 21 into connector 24 of lower portion 122. In a particularembodiment upper portion 23 is moveable (e.g., rotatable) relative tolower portion 122. Upper portion 23 rotates until connector 24 acceptsspindle 22. This motion is represented in FIG. 6. In an alternativeembodiment, upper portion 23 is installed to lower portion 122 bylowering upper portion 23 onto lower portion 122. In another embodiment,lower portion 122 is coupled to circuit board 11. Connector (not shown)on lower portion 122 provides lower portion 122 to receive electricalsignals from circuit board 11. Through the connection between lowerportion 122 and upper portion 23 the electrical signals may be passed toupper portion 23. In this manner connector 24 provides electricalsignals to spindles 21 and 22 respectively. The electrical signalsprovide active cooling devices 18 with power, control, rotation speed,etc. signals. In another embodiment spindle 21 passes through lowerportion 122 and is conjoined with connector means (not shown) on circuitboard 11. The electrical signals from circuit board 11 pass to activecooling device 18 through spindles 21 and 22. In another embodimentspindles 21 and 22 may be hollow and serving as a conduit, to allow forelectrical wires (not shown) to transmit electrical signals (i.e.,power, control, rotation speed, etc) to active cooling device 18.

FIG. 7A, FIG. 7B, and FIG. 7C illustrate active cooling device 25 andconnector 28. In this embodiment, at least one connector 28 is mountedto circuit board 11. At least one active cooling device 25 attach toconnector 28. As described previously, with reference to active coolingdevice 18, active cooling device 25 rotates about axis 7 (FIG. 4A).Active cooling device 18 utilizes at least one spindle to provide forrotation. In the embodiment shown in FIG. 7B, two spindles 26 and 27 areutilized to provide for rotation. In a particular embodiment to aidrotation, one or more ball bearing sets 29 and 30 may be utilized. Inanother embodiment the one or more spindles 26 and 27 may be fixedrelative to active cooling device 25, wherein only the one or more ballbearing sets 29 and 30 provide for rotation. In another embodimentspindle 29 and 30 are hollow and provide a conduit to route electricalcables to transmit electrical signals (i.e., power, control, rotationspeed, etc) to active cooling device 25 from circuit board 11.

FIG. 8 illustrates a top view of apparatus 15 in an operatingconfiguration wherein all active cooling devices 13 ₁-13 ₄ arefunctional. Active cooling devices 13 ₁-13 ₄ each propel fluid streamscontained in spatial volumes 31-34 respectively.

FIG. 9 illustrates a top view of apparatus 15 upon the failure of activecooling device 13 ₁. In this particular embodiment rotation occurs dueto the average relative pressures differentials of adjacent fluidstreams. In other words when a particular active moving device partiallyfails, the loss of fluid flow from that particular device causes theother active cooling devices to move, adjust position, rotate, etc.Because active cooling device 13 ₁ has failed to propel a fluid stream,spatial volume 31 decreases in average pressure. The average pressure inspatial volume 32 is higher relative to the average pressure of spatialvolume 31. Because of the pressure difference, active cooling device 13₂ moves (e.g., rotates) toward spatial volume 31. The fluid stream fromactive cooling device 13 ₂ consequently is located in spatial volume 35.The average pressure of spatial volume 35 after rotating is relativelyhigh. The pressure of spatial volume 32 after active cooling device 13 ₂moves (e.g., rotates) is low. The average pressure in spatial volume 33is higher relative to the average pressure of spatial volume 32. Becauseof the pressure difference, active cooling device 13 ₃ moves (e.g.,rotates) toward spatial volume 32. After rotating, the fluid stream fromactive cooling device 13 ₃ consequently is located in spatial volume 36.The average pressure of spatial volume 36 after rotating is relativelyhigh. The average pressure of spatial volume 33 after rotating isrelatively low. The pressure in spatial volume 34 is higher relative tothe pressure of spatial volume 33. Because of the pressure difference,active cooling device 13 ₄ moves (e.g., rotates) toward spatial volume33. The fluid stream from active cooling device 13 ₄ consequently islocated in spatial volume 37. The average pressure of spatial volume 37after rotating is relatively high. The average pressure of spatialvolume 34 after rotating is relatively low. The depicted rotation, asshown in FIG. 9, may not be drawn to scale. For instance actual rotationmay be less than as shown in FIG. 9. Further, the amount of rotation ofeach individual active air moving device may not be similar to any otherparticular active moving device.

FIG. 10 illustrates an isometric view of a circuit board 39. FIG. 10illustrates a further embodiment of the invention in which a bank ofactive cooling devices adjusts, moves, rotates, etc. on a partialfailure of at least one particular cooling device. Circuit board 39 hasa connector 28 thereupon configured to interconnect with spindles 26 and27 of active cooling device 45. Circuit board 39 also has electro-magnetelements 41-44 positioned around connector 28. Circuit board 39 providessignals to electro-magnet elements 41-44. These signals control thepolarity of electro-magnet elements 41-44. Connector 28 provideselectrical signals (i.e., power, control, rotation speed, polarity etc)to active cooling device 45. FIG. 11 illustrates an isometric view ofactive cooling device 45 supported by circuit board 39 according toanother embodiment of the present invention. On the underside of activecooling device 45, spindles 26 and 27 provide the ability for activecooling device 45 to move (e.g., rotate) relative to circuit board 39.Electro-magnet elements 46-49 are positioned around spindles 26 and 27.When active cooling device 45 is installed to circuit board 39 byinserting spindles 26 and 27 to connector 28, electro-magnet elements41-44 align with electro-magnet elements 46-49. Electro-magnet element41 is aligned with electro-magnet element 49, electro-magnet element 42is aligned with electro-magnet element 48, electro-magnet element 43 isaligned with electro-magnet element 46, and electro-magnet element 44 isaligned with electro-magnet element 47. To control rotation the polarityof particular electro-magnet elements 41-44 and/or 46-49 is reversed.For example to control rotation of active cooling device 45 the polarityof electro-magnet elements 41-44 are reversed. This results in a momentabout axis 7 (as shown in FIG. 2). If rotation is needed in the oppositedirection, the polarity of electro-magnet elements 46-49 is reversed. Anelectronic signal from circuit board 39 controls the polarity ofelectro-magnet elements 46-49.

FIG. 12 illustrates a top view of a section of a circuit board 54 havingelectrical contact tracks 57-60, connector 56, and direction track 55thereupon according to another embodiment of the present invention. In aparticular embodiment contact track 57 provides a negative signal,contact track 58 provides a good signal (i.e., fan good), contact track59 provides a PWM (pulse width modulation) input signal (i.e.,controlling fan speed), and contact track 60 provides a positive signalto active cooling device 63. Connector 56 may be configured to eitherprovide rotation to active cooling device 63 by utilizing bearing means(not shown) or provide rotation to active cooling device 63 bysupporting spindles 26 and 27. Directional track 55 provides rotationaldirection control and function to active cooling device 63. In aparticular example directional track 55 consists of a plurality ofpolarity producing elements providing functional rotation to activecooling device 63. In another example directional track 55 consists of aplurality of MEMS (micro electrical mechanical systems) providingfunctional rotation to active cooling device 63. In a particularembodiment, contact tracks 57-60 are not complete circles, but ratherpartial circular tracks. And in yet another particular embodiment, oneportion of contact tracks 57-60 provide signals to a first blade (notshown) in active cooling device 63 (FIG. 13) that moves (e.g. rotates)in a first direction. A second portion of contact tracks 57-60 providessignals to a second blade (not shown) in active cooling device thatmoves (e.g., rotates) in a second direction.

FIG. 13 and FIG. 14 illustrate active cooling device 63 that issupported by circuit board 54. The underside of active cooling device 63has contact members 65-68, spindles 26 and 27, and directional track 64arranged thereupon. Contact members 65-68 contact and receive therespective signals outputted by the contact tracks 57-60 (FIG. 12).Directional track 64 provides rotational direction control and functionto active cooling device 63. In a particular example directional track64 consists of a plurality of polarity producing elements providingfunctional rotation to active cooling device 63. In another exampledirectional track 64 consists of a plurality of MEMS (micro electricalmechanical systems) providing functional rotation to active coolingdevice 63.

FIG. 15 illustrates apparatus 20 for cooling an electronic system. FIG.16, FIG. 17A-D, and FIG. 18A-C illustrate components of apparatus 20.Apparatus 20 consists of circuit board 11, heat generating component 8having heat dissipating element 12 thereupon, a bank 71 of coolingdevices 72 ₁-72 ₄, and support 73 having an integrated connector(s) 74.Cooling devices 72 ₁-72 ₄, herein referred to generically as coolingdevices 72, move (e.g., rotate) relative to circuit board 11 aboutconnectors 75 on support 73. Support 73 is joined to circuit board 11 byone or more connectors 74. Cooling devices 72 are installed to support73, by attaching spindles 78 and 79 to connectors 75. This sub assemblyis installed to circuit board 11 by attaching connector(s) 74 toassociated connectors (not shown) located on circuit board 11.

Active cooling device 72 utilizes multiple signal pins 81-86 toeffectively receive and/or output multiple signals from circuit board11. Circuit board 11, and active cooling device 72 carry and/or generatemultiple signals (i.e., positive, negative, PWM, good, tach (i.e., acomponent used for measuring the rate of revolution of a shaft), lightemitting diode (LED) positive, LED negative, etc.) used to controldifferent aspects of active cooling device 72, or provide informationabout active cooling device 72 to another electrical component (notshown). These signals are received and/or outputted on signal pins101-108 in connector 74 and are routed through support 73 using internalconductive paths (not shown) and enter/exit support 73 upon signals pins87-92. Signal pins 81-86 rotate relative to spindles 78 and 79. Signalpins 87-92 rotate relative to connector 75 and support 73. In aparticular embodiment, active cooling device 72 utilizes only onespindle.

FIG. 19 illustrates apparatus 100 for cooling an electronic system in anormal operating configuration, and FIG. 20 illustrates components ofapparatus 100. Apparatus 100 comprises circuit board 11, heat generatingcomponent 8 having heat dissipating element 12 thereupon, a bank 111 ofcooling devices 72 ₁-72 ₄, and support 112 having an integratedconnector 117. Bank 111 is attached to intermediary 114 and moves (e.g.,rotates) relative to circuit board 11. Support 112 is joined to circuitboard 11 by one or more connectors 74. Cooling devices 72 are installedto intermediary 114, by attaching connector means 78 and 79 toconnectors 116. This sub assembly is attached to support 112 byinterconnecting connectors 117 and 118. This higher level sub assemblyis installed to circuit board 11 by attaching connector(s) 74 toassociated connectors (not shown) located on circuit board 11. Connector117 and/or 118 moves (e.g., rotates) relative to support 112 andintermediary 114 respectively enabling intermediary 114 to move (e.g.,rotate) relative to support 112.

FIG. 21 and FIG. 22 illustrate apparatus 100 in a configuration whereinat least one active cooling device has failed. In a particularembodiment active cooling device 72 ₁ has failed. At least one remainingfunctional cooling devices 72 ₂-72 ₄ is throttled higher, therebypropelling the respective fluid streams at a higher flow rate. In thisparticular embodiment, active cooling device 72 ₂ is throttled more thanthe other functional cooling devices 72 ₃ and 72 ₄. The force of thepropelled fluid stream, from active cooling device 72 ₂ creates a momentabout connector 118. The moment causes intermediary 114 and bank 111 tomove (e.g., rotate). To aid in rotation active cooling device 72 ₃ and72 ₄ may be throttled down, thereby propelling fluid at a lower flowrate and increasing the moment about connector 118. In an alternativeembodiment bank 111 is forcibly moved (e.g., rotated) upon a particularactive cooling device failure. Bank 111 is moved (e.g., rotated) by aforce mechanism (not shown) that places a force or moment upon theintermediary 114.

FIG. 24 illustrates a method 130 of providing for real time adaptiveactive fluid flow cooling, according to an embodiment of the invention.Providing for adaptive active fluid flow cooling begins at block 131.Method 130 continues by providing for a heat generating component on acircuit board within an electronic system to warm to a temperaturehigher than the electronic system ambient temperature (block 132).Method 130 continues by providing for the cooling of the heat generatingcomponent by mounting a heat dissipating element thereupon (block 133).Method 130 continues by providing for the cooling of the heatdissipating element by directing the fluid flow streams of a pluralityof active cooling device(s) toward the heat dissipating element in afirst direction (block 134). Method 130 continues responsive to one ormore failed active cooling devices, by providing for directing the fluidflow stream of one or more active cooling device(s) toward the heatdissipating element in a second direction (block 135). Method 130 endsat block 136.

In the previous detailed description of exemplary embodiments of theinvention, reference was made to the accompanying drawings (where likenumbers represent like elements), which form a part hereof, and in whichis shown by way of illustration specific exemplary embodiments in whichthe invention may be practiced. These embodiments were described insufficient detail to enable those skilled in the art to practice theinvention, but other embodiments may be utilized and logical,mechanical, electrical, and other changes may be made without departingfrom the scope of the present invention. In the previous description,numerous specific details were set forth to provide a throughunderstanding of embodiments of the invention. But, the invention may bepracticed without these specific details. In other instances, well knownstructures, and techniques have not been shown in detail in order not toobscure the invention. Different instances of the word “embodiment” asused within this specification do not necessarily refer to the sameembodiment, but they may. The previous detailed description is,therefore, not to be taken in a limiting sense, and the scope of thepresent invention is defined only by the appended claims. The termsfailure and partial failure are used interchangeably to denote anyfailure or deviation from normal operation.

1. An active cooling device comprising: a housing that supports meansfor emitting a fluid stream, the fluid stream emitted in a firstdirection, and; a spindle mounted to the housing, the housing able torotate about the spindle, the spindle being mounted to the housing on amounting plane parallel to the fluid stream, the mounting plane beingoffset from a bisection plane of the fluid stream, the bisection planealso being parallel to the fluid stream; such that when the fluid streamis emitted, the force of the emitted fluid stream creates a moment aboutthe spindle.
 2. The active cooling device of claim 1 further comprising:retention means to retain the housing from rotating.
 3. The activecooling device of claim 2 wherein the retention means is removed upon apartial failure of one or more other active cooling devices, whereinupon removing the retention means, the housing rotates causing the fluidstream to be emitted in a second direction.
 4. An active cooling devicecomprising: a first active cooling device amongst a plurality of activecooling devices that rotates caused at least in part to a differentialpressure created from a decreased fluid flow emission of a second activecooling device amongst the plurality of active cooling devices.
 5. Theactive cooling device of claim 4 wherein the rotation of the firstactive cooling device is about an axis perpendicular to a circuit card.6. The active cooling device of claim 4 wherein the rotation of thefirst active cooling device is about an axis parallel to a circuit card.7. The active cooling device of claim 4 further comprising: a frame tosupport the first active cooling device amongst the plurality of activecooling devices.
 8. The active cooling device of claim 7 wherein thefirst active cooling device is electrically connected and mechanicallyconnected to the frame, the frame being at least electrically connectedto a circuit card.
 9. The active cooling device of claim 7 wherein thefirst active cooling device is mechanically connected to the frame andelectrically connected to a circuit card.
 10. The active cooling deviceof claim 7 wherein the first active cooling device and the frame rotatesrelative to a circuit card.
 11. The active cooling device of claim 7wherein the first active cooling device rotates relative to the frameabout a bisection axis of the individual cooling device.
 12. The activecooling device of claim 7 wherein the first active cooling devicerotates relative to the frame about an axis offset from a bisection axisof the individual cooling device.
 13. The active cooling device of claim4 further comprising: a frame to support the plurality of active coolingdevices.
 14. The active cooling device of claim 13 wherein the pluralityof active cooling devices are electrically connected and mechanicallyconnected to the frame, the frame being at least electrically connectedto a circuit card.
 15. The active cooling device of claim 13 wherein theplurality of active cooling devices are mechanically connected to theframe and electrically connected to a circuit card.
 16. The activecooling device of claim 13 wherein the plurality of active coolingdevices and the frame rotates relative to a circuit card.
 17. The activecooling device of claim 13 wherein each individual active cooling deviceamongst the plurality of active cooling devices rotates relative to theframe.
 18. The active cooling device of claim 13 wherein each individualactive cooling device amongst the plurality of active cooling devicesrotates about a bisection axis of each individual cooling devicerelative to the frame.
 19. The active cooling device of claim 13 whereineach individual active cooling device amongst the plurality of activecooling devices rotates about an axis offset from a bisection axis ofeach individual cooling device relative to the frame.